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The HELITRONIC MICRO from the HELITRONIC family produces and sharpens rotationally symmetrical tools and production parts with smaller diameters. From 0.1 mm diameter in production, from 3 mm diameter when resharpening, maximum diameter12.7 mm, tool length up to 120 mm, maximum weight up to 12 kg.
Grinding complex geometries on rotationally symmetrical tools, in the growth market of small to the smallest diameter, is the core capability of the HELITRONIC MICRO. High mechanical process stability and sophisticated kinematics, with five interpolation axes and two positioning axes, ensure excellent grinding results in production or regrinding.
Grinding complex geometries on rotationally symmetrical tools, in the growth market of small to the smallest diameter, is the core capability of the HELITRONIC MICRO. High mechanical process stability and sophisticated kinematics, with five interpolation axes and two positioning axes, ensure excellent grinding results in production or regrinding.
Mechanical axes
X axis 385 mm
Y axis 320 mm
Z axis 320 mm
X axis 385 mm
Y axis 320 mm
Z axis 320 mm
Grinding spindle drive
Max. grinding wheel diameter 150 mm
Grinding spindle speed 0-10.500 min-1
Max. grinding wheel diameter 150 mm
Grinding spindle speed 0-10.500 min-1
Others
Machine weight approx. 6000 kg
Power consumption at 400 V/50 Hz approx. 25 kVA
Machine weight approx. 6000 kg
Power consumption at 400 V/50 Hz approx. 25 kVA